Fei Su

Su Fei is a veteran chip architect and semiconductor reliability engineer who returned to China in September 2025 after nearly 20 years at Intel, joining Tsinghua University as the Xing-Hua endowed chair professor at the School of Integrated Circuits — his alma mater. At Intel, his work spanned the entire chip life cycle from concept to mass production, with a focus on reliability, security, and long-term performance of advanced microprocessors used in everything from smartphones to data centres.

Su earned his bachelor's and master's degrees from Tsinghua University in 1999 and 2001 respectively, before completing a PhD in electrical and computer engineering at Duke University in 2006. He joined Intel that same year and rose to become a DFX and Telemetry Architect. He is a senior member of the IEEE and received the SRC Mahboob Khan Outstanding Liaison Award in 2021.

Su said his biggest motivation for returning was to bridge the gap between academia and industry in China's semiconductor sector, and to mentor young engineers navigating the rapidly evolving computing and chip industry.